Application: Semiconductor Industry
Weight:0.2kg
Structure: Smooth inner wall
Type: Flared Connection
Melting point:303℃
Use fluid : Strong acid and strong base
Elongation:410%
Application: Semiconductor Industry
Weight:0.2kg
Structure: Smooth inner wall
Type: Flared Connection
Melting point:303℃
Use fluid : Strong acid and strong base
Elongation:410%


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